NORTH CORP innovation strategy

Patent filings in countries

#	Country	Total Patents
#1	China	6
#2	Republic of Korea	6
#3	United States	6
#4	Taiwan	4
#5	WIPO (World Intellectual Property Organization)	4
#6	EPO (European Patent Office)	3

#	Technology
#1	Casings and printed circuits
#2	Semiconductor devices
#3	Unspecified technologies
#4	Physical therapy devices
#5	Grinding or polishing devices
#6	Spraying devices
#7	Measuring electric variables
#8	Photomechanical semiconductor production

Publication	Filing date	Title
CN101408688A	2004-03-31	Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module
KR20040086783A	2004-03-30	Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module
WO03101163A1	2003-05-27	Wiring substrate, method for producing the same, and semiconductor chip inspection equipment utilizing it
CN101409978A	2002-03-27	Multi-layer wiring board, interconnection blank and interconnection element capable of being patterned, and manufacturing method of the multi-layer wiring board
US6782610B1	1999-12-20	Method for fabricating a wiring substrate by electroplating a wiring film on a metal base