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HONGQISHENG PREC ELECTRONICS (QINHUANGDAO) CO LTD

Overview
  • Total Patents
    30
  • GoodIP Patent Rank
    52,624
  • Filing trend
    0.0%
About

HONGQISHENG PREC ELECTRONICS (QINHUANGDAO) CO LTD has a total of 30 patent applications. It increased the IP activity by 0.0%. Its first patent ever was published in 2014. It filed its patents most often in China and United States. Its main competitors in its focus markets audio-visual technology, semiconductors and machines are AT & S AUSTRIA TECH & SYSTEMTECHNIK AG, MEIKO ELECTRONICS CO LTD and TESSERA INTERCONNECT MATERIALS.

Patent filings in countries

World map showing HONGQISHENG PREC ELECTRONICS (QINHUANGDAO) CO LTDs patent filings in countries
# Country Total Patents
#1 China 20
#2 United States 10

Patent filings per year

Chart showing HONGQISHENG PREC ELECTRONICS (QINHUANGDAO) CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Hu Xianqin 7
#2 He Mingzhan 7
#3 Li Yanlu 7
#4 You Wenxin 5
#5 Huang Yu-Cheng 4
#6 Su Weishuo 4
#7 Li Yan-Lu 3
#8 Wang Kai 3
#9 Huang Yucheng 3
#10 Yuan Gang 2

Latest patents

Publication Filing date Title
CN111200907A Tear-film-free embedded circuit board and manufacturing method thereof
CN111182742A Circuit board and manufacturing method thereof
CN106488652A Flexible PCB and preparation method thereof
CN106470526A Induction structure, flexible PCB and preparation method thereof
CN106376169A Circuit board and manufacturing method thereof
CN106376170A Flexible circuit board, manufacturing method thereof, and electronic device
CN106341945A Flexible circuit board and manufacturing method thereof
CN106332435A Flexible printed circuit board and manufacturing method therefor
CN106304611A Circuit board and manufacture method thereof, apply the electronic installation of this circuit board
CN105990303A Composite circuit board, manufacturing method thereof and semiconductor package structure
CN105990155A Chip package substrate, chip package structure and manufacturing method thereof
CN105762131A Package structure and manufacturing method thereof
CN105764298A Heat dissipation structure, manufacturing method therefor, and device employing heat dissipation structure
CN105657988A Flexible circuit board and manufacturing method thereof
CN105590914A Electronic component packaging structure and manufacturing method
CN105592639A Circuit board and manufacturing method thereof
CN105491796A Manufacturing method of circuit board
CN105472862A Wireless charging circuit board and manufacturing method thereof
CN105448856A Chip package structure, method of making same and chip package substrate
CN105448883A Chip package substrate, chip package structure and method for manufacturing both the two