GRUBER PETER A has a total of 13 patent applications. Its first patent ever was published in 2007. It filed its patents most often in United States and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, audio-visual technology and machine tools are PANG MENGZHI, SAKURAI DAISUKE and SMARTRAC TECH GMBH.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 12 | |
#2 | WIPO (World Intellectual Property Organization) | 1 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Audio-visual technology | |
#3 | Machine tools | |
#4 | Machines | |
#5 | Surface technology and coating |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Casings and printed circuits | |
#3 | Soldering, welding and flame cutting | |
#4 | Unspecified technologies | |
#5 | Layered products |
# | Name | Total Patents |
---|---|---|
#1 | Gruber Peter A | 13 |
#2 | Nah Jae-Woong | 7 |
#3 | Lauro Paul A | 3 |
#4 | Henderson Donald W | 3 |
#5 | Kang Sung K | 3 |
#6 | Shih Da-Yuan | 3 |
#7 | Hobbs Philip Charles Danby | 2 |
#8 | Knickerbocker John Ulrich | 1 |
Publication | Filing date | Title |
---|---|---|
US2014065771A1 | Double solder bumps on substrates for low temperature flip chip bonding | |
US2014035150A1 | Metal cored solder decal structure and process | |
US8162203B1 | Spherical solder reflow method | |
US2011233762A1 | Wafer level integrated interconnect decal and manufacturing method thereof | |
US2011201194A1 | Direct IMS (injection molded solder) without a mask for forming solder bumps on substrates | |
US2008182124A1 | Modification of solder alloy compositions to suppress interfacial void formation in solder joints |