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HUAIAN IMAGING DEVICE MFT CORP

Overview
  • Total Patents
    775
  • GoodIP Patent Rank
    1,979
  • Filing trend
    ⇧ 407.0%
About

HUAIAN IMAGING DEVICE MFT CORP has a total of 775 patent applications. It increased the IP activity by 407.0%. Its first patent ever was published in 2017. It filed its patents most often in China, United States and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, audio-visual technology and optics are GRAPHIC TECHNO JAPAN CO LTD, FAIRCHILD SEMICONDUCTOR INC and OPTOPAC INC.

Patent filings in countries

World map showing HUAIAN IMAGING DEVICE MFT CORPs patent filings in countries

Patent filings per year

Chart showing HUAIAN IMAGING DEVICE MFT CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Huang Xiaolu 184
#2 Lin Zongxian 173
#3 Huang Rende 96
#4 Wu Longjiang 84
#5 Chen Shijie 68
#6 Wu Zongyou 61
#7 Wu Xiaozhe 49
#8 Lin Zongde 41
#9 Li Zhiwei 39
#10 Li Tianhui 32

Latest patents

Publication Filing date Title
CN110716302A Optical element, aberration correction device, lithography machine system and aberration correction method
CN110676277A Image sensor and forming method thereof
CN110676276A Image sensor, forming method and operating method thereof
CN110610954A Image sensor and forming method thereof
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CN110660818A Method of manufacturing image sensor
CN110620126A Image sensor and method for manufacturing the same
CN110556333A Heating base and semiconductor processing equipment
CN110518030A Semiconductor device and its manufacturing method
CN110518029A Imaging sensor and preparation method thereof
CN110475085A Reading circuit and its control method, the imaging sensor of imaging sensor
CN110518028A Manufacture of substrates, substrate bonding method and semiconductor device
CN110544701A Semiconductor structure and forming method thereof
CN110544702A Semiconductor structure and forming method thereof, image sensor and forming method thereof
CN110501870A A kind of optical proximity effect modification method
CN111081580A Method for detecting broken bond strength of wafer
CN110473827A Manufacture of substrates and substrate bonding method
CN110491892A Imaging sensor and preparation method thereof
CN110459457A A kind of application method of vacuum precleaning device and forming method, vacuum precleaning device
CN110310971A Imaging sensor and forming method thereof