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IMPAC TECHNOLOGY CO LTD

Overview
  • Total Patents
    27
About

IMPAC TECHNOLOGY CO LTD has a total of 27 patent applications. Its first patent ever was published in 2003. It filed its patents most often in Taiwan, China and United States. Its main competitors in its focus markets semiconductors, machines and audio-visual technology are GRAPHIC TECHNO JAPAN CO LTD, FAIRCHILD SEMICONDUCTOR INC and CROSSTEK CAPITAL LLC.

Patent filings in countries

World map showing IMPAC TECHNOLOGY CO LTDs patent filings in countries
# Country Total Patents
#1 Taiwan 13
#2 China 7
#3 United States 7

Patent filings per year

Chart showing IMPAC TECHNOLOGY CO LTDs patent filings per year from 1900 to 2020

Focus industries

Top inventors

# Name Total Patents
#1 Chang Chia-Shuai 11
#2 Wu Chia-Ming 9
#3 Hsu Chih-Yang 7
#4 Chuang Cheng-Lung 6
#5 Huang Chi-Chih 5
#6 Zhiyang Xu 4
#7 Jizhi Huang 3
#8 Chenglong Zhuang 2
#9 Lin Chi-Cheng 1
#10 Qizheng Lin 1

Latest patents

Publication Filing date Title
CN101714510A Image sensing device and packaging method thereof
TW201013905A Image sensing device and packaging method thereof
CN101673690A Image sensing device and encapsulating method thereof
TW201011841A Image sensing device and packaging method thereof
US2010025793A1 Assembly for image sensing chip and assembling method thereof
CN101599444A Image-sensing device and encapsulation method thereof
TW200950072A Packaging method of image sensing device
CN101567321A Encapsulating method of image sensor
CN101567333A Image sensor and encapsulating method thereof
US2009256222A1 Packaging method of image sensing device
TW200943442A Packaging method of image sensing device
TW200943441A Packaging method of image sensing device
US2009224344A1 Packaging method of image sensing device
US2009215216A1 Packaging method of image sensing device
TW200837933A Image sensing module and method for packaging the same
CN101192548A Chip packaging and chip packaging method
TW200822317A Chip package and chip packaging method
US2008099866A1 Image sensing module and method for packaging the same
US2008087975A1 Chip package and chip packaging method
TW200810538A Image sensing module