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HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD

Overview
  • Total Patents
    124
  • GoodIP Patent Rank
    13,254
  • Filing trend
    ⇧ 40.0%
About

HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD has a total of 124 patent applications. It increased the IP activity by 40.0%. Its first patent ever was published in 2008. It filed its patents most often in Japan, Taiwan and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets macromolecular chemistry and polymers, optics and semiconductors are OGIHARA TSUTOMU, ECHEM SOLUTIONS CORP and SUZHOU RUIHONG ELECTRONIC CHEMICAL CO LTD.

Patent filings per year

Chart showing HITACHI CHEMICAL DUPONT MICROSYSTEMS LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Enomoto Tetsuya 53
#2 Matsukawa Daisaku 27
#3 Yoshizawa Atsutaro 26
#4 Nakamura Tadamitsu 25
#5 Saito Nobuyuki 24
#6 Soejima Kazuya 22
#7 Koibuchi Yukari 22
#8 Suzuki Keiko 19
#9 Asada Akira 19
#10 Ohe Masayuki 17

Latest patents

Publication Filing date Title
WO2020071437A1 Photosensitive resin composition, method for manufacturing pattern-cured product, cured product, interlayer insulation film, cover coat layer, surface protection film, and electronic component
WO2020071422A1 Photosensitive resin composition, production method for patterned cured film, cured film, interlayer insulating film, cover coat layer, surface protection film, and electronic component
WO2020071204A1 Photosensitive resin composition, method for producing patterned cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic component
WO2020071201A1 Photosensitive resin composition, method for producing patterned cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic component
WO2020070924A1 Photosensitive resin composition, method for producing cured pattern, cured product, interlayer insulating film, cover coat layer, surface protective film and electronic component
JP2020122875A Photosensitive resin composition, method for producing pattern cured product, cured product, interlayer insulation film, cover coat layer, surface protective film and electronic component
TW201934586A Photosensitive resin composition, method for producing patterned cured film, cured film, interlayer insulating film, cover coat layer, surface protective film and electronic component
JP2020064186A Photosensitive resin composition, method for producing pattern cured film, cured product, interlayer insulation film, cover coat layer or surface protective film, and electronic component
JP2020056957A Photosensitive resin composition, method for producing cured pattern, cured product, interlayer insulating film, cover coat layer, surface protective film and electronic component
JP2020056956A Photosensitive resin composition, method for producing cured pattern, cured product, interlayer insulating film, cover coat layer, surface protective film and electronic component
JP2020056934A Method for producing pattern cured film, photosensitive resin composition, cured film, interlayer insulating film, cover coat layer, surface protective film and electronic component
WO2020031240A1 Photosensitive resin composition, method for producing patterned cured film, cured film, interlayer insulation film, cover coat layer, surface protective film, and electronic component
JP2020002281A Resin composition, method for producing cured product, cured product, interlayer insulation film, cover coat layer, surface protective film and electronic component
JP2020003699A Photosensitive resin composition, method for producing pattern cured product, cured product, interlayer insulation film, cover coat layer, surface protection film and electronic component
WO2019193647A1 Method for producing polyimide precursor, method for producing photosensitive resin composition, method for producing patterned cured object, method for producing interlayer dielectric film, cover coat layer, or surface-protective film, and method for producing electronic component
JP2019152791A Photosensitive resin composition, patterned cured film production method, cured film, interlayer insulating film, cover coat layer, surface protective film, and electronic component
JP2018146964A Photosensitive resin composition, method for producing pattern cured product, cured product, interlayer insulation film, cover coat layer, surface protective film and electronic component
WO2018155547A1 Photosensitive resin composition, cured pattern production method, cured product, interlayer insulating film, cover coat layer, surface protective layer, and electronic component
JP2019113582A Photosensitive resin composition, method for producing patterned cured film, cured film, interlayer insulation film, cover coat layer, surface protection film and electronic component
WO2019064540A1 Photosensitive resin composition, method for producing patterned cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic component