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GUANGDONG HEMU TECH CO LTD

Overview
  • Total Patents
    16
  • GoodIP Patent Rank
    105,283
  • Filing trend
    ⇧ 200.0%
About

GUANGDONG HEMU TECH CO LTD has a total of 16 patent applications. It increased the IP activity by 200.0%. Its first patent ever was published in 2017. It filed its patents most often in China. Its main competitors in its focus markets semiconductors, materials and metallurgy and surface technology and coating are HERAEUS ORIENTAL HITEC CO LTD, ABIKO KENJI and LEE JUN-DER.

Patent filings in countries

World map showing GUANGDONG HEMU TECH CO LTDs patent filings in countries
# Country Total Patents
#1 China 16

Patent filings per year

Chart showing GUANGDONG HEMU TECH CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Cui Chengqiang 15
#2 Zhang Yu 14
#3 Zhou Zhangqiao 13
#4 Yang Bin 12
#5 Yang Guannan 10
#6 Tian Peng 1
#7 Zhou Zhiqiang 1
#8 Lai Tao 1

Latest patents

Publication Filing date Title
CN111876810A Silver-based bonding wire cathode passivation protective solution and preparation method and application thereof
CN111157454A Bonding wire fixture
CN111151587A Wire drawing die and manufacturing method and application thereof
CN111057930A High-purity micro-alloy copper alloy electronic material and preparation method thereof
CN110394368A A kind of heat radiating type wire-drawing die
CN110238124A A kind of bonding wire device for cleaning mould
CN110299293A Modular surface integral type guard method after a kind of chip bonding wire
CN110349872A A kind of guard method of bonding welding point
CN110219029A A kind of bonding wire cathode passivation protection treatment process
CN112111776A Cathode passivation protection solution for silver bonding wire
CN110164776A A kind of production method of bonding wire protective coating
CN110164785A The guard method of solder joint after a kind of bonding wire routing
CN108315725A A kind of minimizing technology of the impurity on silver bonding wire surface
CN108281359A A kind of organic anti-oxidation method of bonding wire
CN108346584A A method of displacement reaction prepares wicker copper bonding wire
CN108198762A A kind of preparation method of double coating bonding brass wires