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GALLANT MICRO MACHINING CO LTD

Overview
  • Total Patents
    38
  • GoodIP Patent Rank
    58,125
  • Filing trend
    ⇩ 71.0%
About

GALLANT MICRO MACHINING CO LTD has a total of 38 patent applications. It decreased the IP activity by 71.0%. Its first patent ever was published in 2011. It filed its patents most often in Taiwan, United States and China. Its main competitors in its focus markets semiconductors, machines and electrical machinery and energy are SAINEKKUSU KK, CONSORZIO EAGLE and TRIMECS CO LTD.

Patent filings in countries

World map showing GALLANT MICRO MACHINING CO LTDs patent filings in countries
# Country Total Patents
#1 Taiwan 32
#2 United States 4
#3 China 2

Patent filings per year

Chart showing GALLANT MICRO MACHINING CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Shih Tun Chih 14
#2 Lai Hung-Neng 8
#3 Huang Liang-Yin 8
#4 Shih Tun-Chih 7
#5 Hsu Chih-Hung 6
#6 Chang Mu-Ching 5
#7 Lai Hung Neng 4
#8 Lin Yi Lun 3
#9 Su Chien Chia 3
#10 Lim Ee-Sun 3

Latest patents

Publication Filing date Title
TWI700234B Die selecting apparatus
TWI697967B Thin die separation method and apparatus thereof
TWI703668B Large size wafer bonding apparatus
TW202039098A Glue filling device for magnetic steel slot of motor rotor core capable of realizing reliable, effective and economical automated magnetic steel slot glue filling
TW202039097A Glue injection equipment for magnetic steel slot of motor rotor iron core capable of effectively ensuring separation of glue waste from glue injected into magnetic steel slot
TWI651253B Storage box with alignment ability
TW201929099A Arranging glue apparatus and method thereof
TWI658967B Automatic high speed packing machine
TW201927664A Retrieval mechanism
TWI650281B Adjusting horizontal system for retrieval unit and method thereof
TWI621154B Vertically die stacked bonder and method using the same
TW201839880A Thin die peeling method
TWI608226B Providing examination and measurement of auto focus apparatus and method using the same
TW201713587A Die precision pick and place apparatus and method using the same and suction module
TW201706196A Clip turning apparatus and the method using the same
TW201643987A Position apparatus of wafer fabrication and method using the same
TW201639696A Pressing apparatus with an ability of manufacturing different products/same products
TW201633420A Apparatus for wafer ring rapid reloading and method using the same
TW201630096A Die picking apparatus with plurality faces inspection ability and method thereof
TW201620060A Wafer mounted apparatus with high yield and method thereof