F & K DELVOTEC BONDTECH GMBH has a total of 23 patent applications. Its first patent ever was published in 2001. It filed its patents most often in EPO (European Patent Office), United States and Japan. Its main competitors in its focus markets semiconductors, machine tools and measurement are SHINKAWA K K, KULICKE & SOFFA IND INC and F&K DELVOTEC BONDTECHNIK GMBH.
# | Country | Total Patents | |
---|---|---|---|
#1 | EPO (European Patent Office) | 7 | |
#2 | United States | 6 | |
#3 | Japan | 5 | |
#4 | Republic of Korea | 5 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Machine tools | |
#3 | Measurement | |
#4 | Control | |
#5 | Audio-visual technology | |
#6 | Machines |
# | Name | Total Patents |
---|---|---|
#1 | Farassat Farhad | 18 |
#2 | Farassat Farhad Dr-Ing | 3 |
#3 | Farassat Farhad Dr | 2 |
Publication | Filing date | Title |
---|---|---|
EP1625911A1 | Wire bonder with a camera, a device for image treatment, memoires et comparing means and process using this wire bonder | |
EP1422986A1 | Chip transfer station for a bonding machine | |
EP1375048A1 | Wire bonding device | |
EP1343201A1 | Method and apparatus for manufacture and quality control of a wire bond | |
EP1333263A1 | Device for carrying out a pull-test | |
EP1310319A1 | Wire bonder and testing method for wire bonds |