ERS ELECTRONIC GMBH has a total of 47 patent applications. It increased the IP activity by 500.0%. Its first patent ever was published in 2002. It filed its patents most often in EPO (European Patent Office), WIPO (World Intellectual Property Organization) and Germany. Its main competitors in its focus markets semiconductors, measurement and machines are UMC JAPAN, EAGLESTONE PARTNERS I LLC and KULICKE & SOFFA MFG CO.
# | Country | Total Patents | |
---|---|---|---|
#1 | EPO (European Patent Office) | 8 | |
#2 | WIPO (World Intellectual Property Organization) | 8 | |
#3 | Germany | 7 | |
#4 | China | 6 | |
#5 | Republic of Korea | 4 | |
#6 | Singapore | 3 | |
#7 | Taiwan | 2 | |
#8 | United States | 2 | |
#9 | Australia | 1 | |
#10 | Canada | 1 | |
#11 | Hong Kong | 1 | |
#12 | Japan | 1 | |
#13 | Malaysia | 1 | |
#14 | Norway | 1 | |
#15 | Poland | 1 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Measurement | |
#3 | Machines |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Measuring electric variables | |
#3 | Unspecified technologies | |
#4 | Measuring light |
# | Name | Total Patents |
---|---|---|
#1 | Reitinger Erich | 17 |
#2 | Reitinger Klemens | 14 |
#3 | Schindler Rüdiger | 5 |
#4 | Schindler Ruediger | 3 |
#5 | Erich Reitinger | 3 |
#6 | Reitinger Klaus | 2 |
#7 | Klemens Reitinger | 1 |
#8 | Ruediger Schindler | 1 |
#9 | Schindler Rudiger | 1 |
Publication | Filing date | Title |
---|---|---|
DE102019207663A1 | Calibration arrangement and corresponding calibration procedure | |
DE102017200588A1 | Device for tempering a substrate and corresponding manufacturing method | |
DE102013215781A1 | Thermal shielding device for a probe card and corresponding probe card assembly | |
WO2011032947A1 | Pinch roll, device, and method for removing a film from a disc-shaped workpiece | |
DE102009045291A1 | Apparatus for conditioning semiconductor chips and test methods using the apparatus | |
DE102009037939A1 | Method and device for determining the deflection of a disk-shaped workpiece | |
DE102008041250A1 | Method and device for the thermal processing of plastic discs, in particular mold wafers | |
DE10216786A1 | Method and apparatus for conditioning semiconductor wafers and / or hybrids |