ENYA SYSTEMS LTD has a total of 17 patent applications. Its first patent ever was published in 1992. It filed its patents most often in Japan, EPO (European Patent Office) and United States. Its main competitors in its focus markets semiconductors, chemical engineering and machine tools are ENYA SYST KK, ENYA SYSTEM KK and KULICKE & SOFFA MFG CO.
# | Country | Total Patents | |
---|---|---|---|
#1 | Japan | 7 | |
#2 | EPO (European Patent Office) | 5 | |
#3 | United States | 5 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Chemical engineering | |
#3 | Machine tools | |
#4 | Machines |
# | Name | Total Patents |
---|---|---|
#1 | Yokosuka Noriyoshi | 7 |
#2 | Suzuki Shizuo | 5 |
#3 | Kaku Yokou | 3 |
#4 | Ooizumi Kimiwaka | 2 |
#5 | Tanaka Kouichi | 2 |
#6 | Yukihiko Terasawa | 1 |
#7 | Hashizume Michihiro | 1 |
#8 | Terasawa Yukihiko | 1 |
#9 | Sato Michihisa | 1 |
#10 | Hamano Makoto | 1 |
Publication | Filing date | Title |
---|---|---|
JP2003045845A | Wafer edge etching washing treatment apparatus | |
JP2002100595A | Device and method for releasing wafer and wafer treatment device using the same | |
JP2002246354A | Method for treating wafer, and mechanical chuck device used for the method | |
JP2002064072A | Wafer bonding method and apparatus thereof | |
JP2001189293A | Method and device for adhering wafer | |
JP2001127026A | Method and device for bonding wafer to mounting board | |
JP2001091917A | Method and device for treating substrate | |
EP0523414A1 | Wafer mounting device | |
EP0499084A1 | Wafer mount plate |