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DYNA TECH CO LTD

Overview
  • Total Patents
    20
  • GoodIP Patent Rank
    120,036
  • Filing trend
    ⇩ 25.0%
About

DYNA TECH CO LTD has a total of 20 patent applications. It decreased the IP activity by 25.0%. Its first patent ever was published in 1998. It filed its patents most often in Republic of Korea, Japan and Singapore. Its main competitors in its focus markets semiconductors, electrical machinery and energy and packaging and shipping are SEMICON LIGHT CO LTD, HONGBIN ZHANG and BENAISSA KAMEL.

Patent filings in countries

World map showing DYNA TECH CO LTDs patent filings in countries
# Country Total Patents
#1 Republic of Korea 17
#2 Japan 1
#3 Singapore 1
#4 Taiwan 1

Patent filings per year

Chart showing DYNA TECH CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Moon Hyoung Joo 7
#2 Jung Eui Seon 5
#3 Kong Young Joon 5
#4 Kong Woo Hyun 3
#5 Lee Joo Yeol 3
#6 Lee Sung Hee 3
#7 Kwak Seung Sin 2
#8 Kong U Hyeon 2
#9 Chung Eun Ju 1
#10 Kim Sang Wook 1

Latest patents

Publication Filing date Title
KR20200055258A Method for Forming Thin Film Replacing Tape
KR101959040B1 type bonding processing used in electrostatic chuck for wafer mounting of semicondutor package
KR20190136165A Apparatus of supporting a substrate for attaching/removing of protective tape
KR101860839B1 Apparatus and method for substrate washing
KR101842590B1 Warpage adjusting apparatus of panel mold wafer
KR101778146B1 Transfer for sliding transport of mold wafer
KR101741079B1 cooling apparatus of mold wafer
KR101741080B1 robot hand for debonding work transort apparatus
KR20170141501A Apparatus for wafer processing
KR101515141B1 Tape roller assembly for wafer processing apparatus
KR101455205B1 Corrector
KR100741168B1 A detaping apparatus using a peeling bar
KR20080004298A Cleaning device for a dicing tape apparatus
KR100663946B1 The apparatus of cutting the protection tape for the semiconductor wafer
KR20020060911A Separation paper rolling device of bonding tape for wafer mounter
KR20020060912A Bonding film cutting device in wafer mounter
KR20000002139A Production method of laminated strip for bga semiconductor package and device thereof