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DOMINTECH CO LTD

Overview
  • Total Patents
    25
About

DOMINTECH CO LTD has a total of 25 patent applications. Its first patent ever was published in 2004. It filed its patents most often in Taiwan, United States and EPO (European Patent Office). Its main competitors in its focus markets semiconductors, micro-structure and nano-technology and measurement are FUJII TETSUO, SENSONOR AS and SML ELECTRONICS INC.

Patent filings in countries

World map showing DOMINTECH CO LTDs patent filings in countries
# Country Total Patents
#1 Taiwan 12
#2 United States 10
#3 EPO (European Patent Office) 3

Patent filings per year

Chart showing DOMINTECH CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Tzu Chung-Hsing 7
#2 Biar Jeff 4
#3 Wu Ming-Ching 4
#4 Shr Kai-R 3
#5 Tz Jung-Shing 3
#6 Wu Ming-Qing 3
#7 Wu Ming Ching 2
#8 Jang Shr-Yi 2
#9 Bai Jin-Quan 2
#10 Li Gang-Wei 2

Latest patents

Publication Filing date Title
EP2426083A2 Mems sensor package
TW201215558A Mems sensor capable of measuring acceleration and pressure
TW201137964A Semiconductor chip sawing method
US2011228481A1 Thermally conductive interface means
US2011141747A1 Bulb for electric lamp
TW201121001A Packaging of micro-electromechanical sensor device
TW201118022A Method of delivering electronic component
TW201034932A Capacitor type three-axis accelerometer for microelectromechanical systems (MEMS)
US2007029680A1 Chip packaging structure without leadframe
TW200539466A Manufacturing method of memory card
US2007020964A1 Memory module with chip hold-down fixture
US2006170082A1 Chip packaging structure adapted to reduce electromagnetic interference
US2006138628A1 Stack chip package
US2006171126A1 Memory card with memory chip replaceable
US2006125063A1 Electrical-interference-isolated transistor structure
TW200511449A Chip packaging method without lead frame
TW200509268A Chip-packaging process without lead frame
TW200500614A Automatic testing system for electronic devices and its method
TW200426959A Stable package method for miniaturized transistor
TW200425375A Wafer package and test method