| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 9 | |
| #2 | Canada | 5 | |
| #3 | EPO (European Patent Office) | 4 | |
| #4 | Republic of Korea | 4 | |
| #5 | WIPO (World Intellectual Property Organization) | 4 | |
| #6 | China | 2 | |
| #7 | United Kingdom | 1 | |
| #8 | Hong Kong | 1 | |
| #9 | Malaysia | 1 | |
| #10 | Singapore | 1 | |
| #11 | Taiwan | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Macromolecular chemistry and polymers | |
| #3 | Basic materials chemistry | |
| #4 | Materials and metallurgy | |
| #5 | Audio-visual technology | |
| #6 | Machines | |
| #7 | Optics |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Adhesives | |
| #3 | Compounding ingredients | |
| #4 | Macromolecular compounds compositions | |
| #5 | Treatment of glass | |
| #6 | Casings and printed circuits | |
| #7 | Unspecified technologies | |
| #8 | Optical systems |
| # | Name | Total Patents |
|---|---|---|
| #1 | Dietz Raymond L | 19 |
| #2 | Patelka Maciej | 8 |
| #3 | Czubarow Pawel | 8 |
| #4 | Dietz Raymond Louis | 8 |
| #5 | Peck David Martin | 5 |
| #6 | Hartman Terrence L | 4 |
| #7 | Peck David M | 4 |
| #8 | Crudele Peter | 3 |
| #9 | Anagnostopoulos Stavros | 3 |
| #10 | Abe Yukinari | 2 |
| Publication | Filing date | Title |
|---|---|---|
| US2010065790A1 | Conductive composition | |
| CN102027091A | Thermally enhanced electrically insulative adhesive paste | |
| CA2696985A1 | Adhesives with thermal conductivity enhanced by mixed silver fillers | |
| US6901203B1 | Fiber optic feed-through tube and method for making the same | |
| US6140402A | Polymeric adhesive paste | |
| US6265471B1 | High thermally conductive polymeric adhesive | |
| US6111005A | Polymeric adhesive paste | |
| US5391604A | Adhesive paste containing polymeric resin | |
| US5334558A | Low temperature glass with improved thermal stress properties and method of use | |
| CA2019413A1 | Low temperature glass composition, paste and method of use | |
| US5076876A | Method of attaching an electronic device to a substrate |