| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 19 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Machines | |
| #3 | Basic materials chemistry | |
| #4 | Macromolecular chemistry and polymers | |
| #5 | Surface technology and coating |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Unspecified technologies | |
| #3 | Adhesives | |
| #4 | Layered products | |
| #5 | Compounding ingredients | |
| #6 | Macromolecular compounds compositions |
| # | Name | Total Patents |
|---|---|---|
| #1 | Takamoto Naohide | 19 |
| #2 | Shiga Goji | 16 |
| #3 | Asai Fumiteru | 10 |
| #4 | Matsumura Takeshi | 6 |
| #5 | Sugimura Toshimasa | 1 |
| #6 | Yamamoto Akiyoshi | 1 |
| #7 | Takahashi Tomokazu | 1 |
| #8 | Shishido Yuuichirou | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US2013099394A1 | Film for back surface of flip-chip semiconductor | |
| US2013095639A1 | Film for back surface of flip-chip semiconductor, dicing-tape-integrated film for back surface of semiconductor, process for producing semiconductor device, and flip-chip semiconductor device |