| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Republic of Korea | 4 | |
| #2 | Taiwan | 4 | |
| #3 | WIPO (World Intellectual Property Organization) | 4 | |
| #4 | China | 3 | |
| #5 | Japan | 2 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Basic materials chemistry |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Adhesives |
| # | Name | Total Patents |
|---|---|---|
| #1 | Kubota Akihiro | 14 |
| #2 | Ishigaki Tomoaki | 11 |
| #3 | Takamatsu Yoshihito | 10 |
| #4 | Ojima Norio | 10 |
| #5 | Yoshida Katsumi | 4 |
| #6 | Sugimoto Emiko | 3 |
| #7 | Sakuma Masao | 3 |
| #8 | Meguro Tatsuya | 3 |
| #9 | Takada Yoshihiko | 3 |
| #10 | Yoshihito Takamatsu | 2 |
| Publication | Filing date | Title |
|---|---|---|
| JP2011216535A | Composite glass epoxy substrate and metal multilayer substrate using the same | |
| WO2010004903A1 | Leadframe and method for manufacturing the same | |
| JP2009239089A | Lead frame and process for producing the same | |
| KR20090089354A | Lead frame, method for manufacturing the lead frame, and semiconductor device having the lead frame mounted thereon | |
| TW200833727A | Wire frame fixing material, lead frame and semiconductor device |