Lead-free low melting glass - contains silver oxide, vanadium oxide and tellurium oxide, used as soldering paste for electrical components
GB9003491D0
A soldering paste for fixing semiconductors to ceramic supports
DE3730764C1
Use of tin and / or lead alloys as soft solders to apply semiconductors to metallic substrates
DE3716852C1
Sputtering target for the production of optically transparent layers and method for producing these targets
DE3632413A1
METHOD FOR THE PRODUCTION OF FLINKING MELTFUSE
DE3631830A1
MULTI-MATERIAL ALLOY FOR TARGETS OF CATHODE SPRAYING SYSTEMS AND THEIR USE
EP0215462A2
Paste for bonding semi-conductors to ceramic underlayers
DE3627775A1
METHOD FOR PRODUCING TARGETS
DE3230376A1
GOLD WIRE FOR SEMICONDUCTOR COMPONENTS
DE2923174A1
SPUTTER TARGET ON CARRIER PLATE
US4236948A
Process for doping semiconductor crystals
DE2853951A1
Contact plate for semiconductor devices or chips - uses porous copper or silver plate covered on both sides with non-porous metal layers
DE2810378A1
Doping semiconductor crystal, esp. silicon crystals - using soln. contg. alkyl and/or aryl poly-silicate(s), plus dopant, and forming silica layer on the crystal
DE2704405A1
Base plate for semiconductor elements - consists of an alloy contg. palladium, tungsten or molybdenum
DE2625092A1
Contact sheet for semiconductor devices - comprising sandwich of metal of specified conductivity with softer outer layers
DE2501528A1
Soldered parts of nonmagnetic material - with marked solder layer, for production of SC components have layers of different composition on each side
