| # | Country | Total Patents | |
|---|---|---|---|
| #1 | China | 9 | |
| #2 | United States | 7 | |
| #3 | Taiwan | 4 | |
| #4 | EPO (European Patent Office) | 2 | |
| #5 | Singapore | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Electrical machinery and energy | |
| #3 | Audio-visual technology | |
| #4 | Biotechnology | |
| #5 | Telecommunications | |
| #6 | Measurement | |
| #7 | Digital networks | |
| #8 | Basic communication technologies |
| # | Name | Total Patents |
|---|---|---|
| #1 | Chen Da-Jung | 9 |
| #2 | Lai Yiu-Wai | 6 |
| #3 | Lim Beng Beng | 4 |
| #4 | Kee Jack Sheng | 3 |
| #5 | Ma Bo | 2 |
| #6 | Zhang Yong | 2 |
| #7 | Utama Revata | 2 |
| #8 | Yiu Wai Lai | 2 |
| #9 | Chen Chien-Ming | 2 |
| #10 | Yiu Jei-Yin | 2 |
| Publication | Filing date | Title |
|---|---|---|
| SG10201604384YA | Embedded package structure | |
| US2016233140A1 | Package structure | |
| US2015255380A1 | Package structure |