| # | Country | Total Patents | |
|---|---|---|---|
| #1 | WIPO (World Intellectual Property Organization) | 3 | |
| #2 | China | 2 | |
| #3 | Republic of Korea | 2 | |
| #4 | Taiwan | 2 | |
| #5 | EPO (European Patent Office) | 1 | |
| #6 | Japan | 1 | |
| #7 | Malaysia | 1 | |
| #8 | United States | 1 |
| # | Industry | |
|---|---|---|
| #1 | Machines | |
| #2 | Audio-visual technology | |
| #3 | Macromolecular chemistry and polymers | |
| #4 | Surface technology and coating | |
| #5 | Semiconductors |
| # | Technology | |
|---|---|---|
| #1 | Casings and printed circuits | |
| #2 | Unspecified technologies | |
| #3 | Compounding ingredients | |
| #4 | Layered products | |
| #5 | Unspecified technologies | |
| #6 | Semiconductor devices |
| # | Name | Total Patents |
|---|---|---|
| #1 | Vasoya Kalu K | 10 |
| #2 | Mangrolia Bharat M | 6 |
| #3 | Bohner Richard A | 4 |
| #4 | Davis William E | 4 |
| #5 | Kalu K Vasoya | 1 |
| #6 | Bharat M Mangrolia | 1 |
| #7 | Richard A Bohner | 1 |
| #8 | Kaluk Vasoya | 1 |
| #9 | William E Davis | 1 |
| #10 | Roy Don | 1 |
| Publication | Filing date | Title |
|---|---|---|
| CN101536619A | Manufacturing process: how to construct constraining core material into printed wiring board | |
| WO2005117508A2 | Printed wiring board with conductive constraining core including resin filled channels | |
| CN101124858A | Printed wiring board with conductive constraining core including resin filled channels | |
| US7173325B2 | Expansion constrained die stack | |
| EP1360067A1 | Lightweight circuit board with conductive constraining cores |