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DAISHO DENSHI KK

Overview
  • Total Patents
    58
About

DAISHO DENSHI KK has a total of 58 patent applications. Its first patent ever was published in 1985. It filed its patents most often in Japan. Its main competitors in its focus markets machines, audio-visual technology and semiconductors are WERESCH THOMAS, NAGAO KAZUHIDE and AIN CO LTD.

Patent filings in countries

World map showing DAISHO DENSHI KKs patent filings in countries
# Country Total Patents
#1 Japan 58

Patent filings per year

Chart showing DAISHO DENSHI KKs patent filings per year from 1900 to 2020

Focus industries

Top inventors

# Name Total Patents
#1 Imamura Eiji 14
#2 Ishikawa Atsushi 10
#3 Koyama Mitsuru 8
#4 Sato Akihiro 8
#5 Deguchi Osamu 7
#6 Sugiyama Tei 6
#7 Owaki Toshio 6
#8 Onuki Hisao 5
#9 Sasaki Masahiro 5
#10 Hoshi Yukinori 3

Latest patents

Publication Filing date Title
JP2009102699A Plating current shielding body, plating tool, plating apparatus and method of manufacturing plated substrate
JP2009105226A Holding tool, detachment auxiliary device, article conveying accommodation and article detaching method
JP2009070895A Manufacturing method for printed wiring board
JP2009070903A Printed wiring board and manufacturing method therefor
JP2009026898A Method of manufacturing multilayer printed wiring board, and multilayer printed wiring board
JP2008300773A Manufacturing method of light emitting element mounting wiring board and light emitting element mounting wiring board
JP2008288494A Organic wiring substrate for mounting semiconductor components and method of manufacturing same
JP2008280555A Plating equipment
JP2008262960A Organic wiring substrate for mounting light emitting device and its manufacturing method
JP2007335631A Manufacturing method of laminated wiring board
JP2007335630A Flexible rigid printed wiring board, and manufacturing method thereof
JP2007088249A Method of manufacturing flex-rigid printed wiring board
JP2007088232A Method of manufacturing printed wiring board
JP2007088230A Flex-rigid printed wiring board
JP2007088231A Flex-rigid printed wiring board
JP2007088229A Flex-rigid printed wiring board
JP2007042992A Substrate and its manufacturing method
JP2007042993A Method for manufacturing multilayer substrate
JP2006339350A Printed wiring board and its manufacturing method
JP2006339349A Printed wiring board and method of manufacturing same