| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 5 | |
| #2 | WIPO (World Intellectual Property Organization) | 3 | |
| #3 | Australia | 2 | |
| #4 | EPO (European Patent Office) | 1 | |
| #5 | Taiwan | 1 |
| # | Industry | |
|---|---|---|
| #1 | Audio-visual technology | |
| #2 | Semiconductors | |
| #3 | Electrical machinery and energy | |
| #4 | Machines | |
| #5 | Surface technology and coating | |
| #6 | Machine tools |
| # | Technology | |
|---|---|---|
| #1 | Casings and printed circuits | |
| #2 | Semiconductor devices | |
| #3 | Capacitors and switching devices | |
| #4 | Unspecified technologies | |
| #5 | Shaping clay | |
| #6 | Layered products | |
| #7 | Presses |
| # | Name | Total Patents |
|---|---|---|
| #1 | Zablotny Gordon O | 12 |
| #2 | Horner James W | 12 |
| #3 | Lower John M Jr | 2 |
| #4 | Lower Jr John M | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US5922168A | Apparatus for making laminated electrical and electronic devices | |
| US5880011A | Method and apparatus for manufacturing pre-terminated chips | |
| US5772838A | Apparatus and method for making laminated electrical or electronic devices from a continuous tape coated on one side with ceramic material | |
| US5242641A | Method for forming filled holes in multi-layer integrated circuit packages | |
| US5057171A | Isostatic press for laminating multi-layer components and method of lamination |