CHIPSCALE INC has a total of 32 patent applications. Its first patent ever was published in 1994. It filed its patents most often in United States, United Kingdom and Australia. Its main competitors in its focus markets semiconductors, electrical machinery and energy and machines are EPISIL TECHNOLOGIES INC, KO CHIH-HSIN and XUE YAN XUN.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 14 | |
#2 | United Kingdom | 7 | |
#3 | Australia | 4 | |
#4 | WIPO (World Intellectual Property Organization) | 4 | |
#5 | Hong Kong | 2 | |
#6 | Japan | 1 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Electrical machinery and energy | |
#3 | Machines |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Unspecified technologies | |
#3 | Resistors |
# | Name | Total Patents |
---|---|---|
#1 | Sander Wendell B | 17 |
#2 | Young James L | 16 |
#3 | Chen Changsheng | 16 |
#4 | Richards John G | 15 |
#5 | Marcoux Phil P | 12 |
#6 | Flores Hector | 11 |
#7 | Richmond Ii Donald P | 5 |
#8 | Richmond Donald P Ii | 3 |
#9 | Richmond Iii Donald P | 2 |
#10 | Richards John Gareth | 1 |
Publication | Filing date | Title |
---|---|---|
US6414585B1 | Integrated passive components and package with posts | |
US6051489A | Electronic component package with posts on the active side of the substrate | |
US5904496A | Wafer fabrication of inside-wrapped contacts for electronic devices | |
US5910687A | Wafer fabrication of die-bottom contacts for electronic devices | |
GB9723470D0 | Resistor fabrication | |
GB9623265D0 | Resistor fabrication | |
US5592022A | Fabricating a semiconductor with an insulative coating | |
US5656547A | Method for making a leadless surface mounted device with wrap-around flange interface contacts |