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CHANGSHU GUANGDA ELECTRICAL APPLIANCES CO LTD

Overview
  • Total Patents
    25
About

CHANGSHU GUANGDA ELECTRICAL APPLIANCES CO LTD has a total of 25 patent applications. Its first patent ever was published in 2010. It filed its patents most often in China. Its main competitors in its focus markets semiconductors are QUANTUM WAFER INC, HERUTSU KK and CHIPMOS TECHNOLOGIES SHANGHAI LTD.

Patent filings in countries

World map showing CHANGSHU GUANGDA ELECTRICAL APPLIANCES CO LTDs patent filings in countries
# Country Total Patents
#1 China 25

Patent filings per year

Chart showing CHANGSHU GUANGDA ELECTRICAL APPLIANCES CO LTDs patent filings per year from 1900 to 2020

Focus industries

# Industry
#1 Semiconductors

Focus technologies

# Technology
#1 Semiconductor devices

Top inventors

# Name Total Patents
#1 Ziyang Xu 22
#2 Xu Ziyang 2
#3 Ming Li 1

Latest patents

Publication Filing date Title
CN102367970A Energy-saving warmer
CN102368484A Multichip integrated circuit packaging structure
CN102368493A Method for packaging integrated circuit chip
CN102368481A High-strength chip packaging structure
CN102402846A Universal remote control device
CN102403762A Universal charger
CN102368494A Anti-electromagnetic interference chip packaging structure
CN102368483A Novel chip packaging structure
CN102403237A Encapsulating method of high-strength chip
CN102403281A High-performance packaging structure of chip
CN102403240A Sealing method of chip
CN102391652A Preparation process for organic silicon rubber for light-emitting diode (LED) chip packaging
CN102368515A Packaging method of LED chip
CN102391651A Formula of organic silicon rubber for light-emitting diode (LED) chip packaging
CN102347286A Anti-interference chip packaging structure
CN102347324A Novel LED (light-emitting diode) integrated packaging structure
CN102347247A Adjustable chip package mold
CN102347246A Method for encapsulating chip with excellent radiating performance
CN102347290A Chip packaging structure with good heat dispersion property
CN102347293A Chip packaging structure with good heat radiation performance