CHEN CHIH-HUA has a total of 17 patent applications. Its first patent ever was published in 2007. It filed its patents most often in United States. Its main competitors in its focus markets semiconductors, audio-visual technology and engines, pumps and turbines are CHANG CHIANG-CHENG, SHIM IL KWON and OHKUCHI ELECTRONICS CO LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 17 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Audio-visual technology | |
#3 | Engines, pumps and turbines | |
#4 | Electrical machinery and energy |
# | Name | Total Patents |
---|---|---|
#1 | Chen Chih-Hua | 17 |
#2 | Chen Chen-Shien | 7 |
#3 | Kuo Chen-Cheng | 5 |
#4 | Shen Wen-Wei | 2 |
#5 | Hsiao Ching-Wen | 2 |
#6 | Ke Chih-Wei | 1 |
#7 | Hsu Kuo-Ching Steven | 1 |
#8 | Liu Tzuan-Horng | 1 |
#9 | Ching Kai-Ming | 1 |
#10 | Tsai Chia-Wen | 1 |
Publication | Filing date | Title |
---|---|---|
US2013182402A1 | PoP structures including through-assembly via modules | |
US2013181325A1 | Through-assembly via modules and methods for forming the same | |
US2013140689A1 | Bump-on-trace structures in packaging | |
US2011193232A1 | Conductive pillar structure for semiconductor substrate and method of manufacture | |
US2011186988A1 | Multi-direction design for bump pad structures | |
US2010084747A1 | Zigzag pattern for TSV copper adhesion | |
US2009102021A1 | Through-silicon vias and methods for forming the same | |
US2008100408A1 | Inductor structure |