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CHANG CHIEN-WEI

Overview
  • Total Patents
    27
About

CHANG CHIEN-WEI has a total of 27 patent applications. Its first patent ever was published in 2004. It filed its patents most often in United States and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets audio-visual technology, semiconductors and biotechnology are DENKA AGSP KK, NEC TOPPAN CIRCUIT SOLUTIONS T and PHOENIX PREC TECHNOLOGY CORP.

Patent filings in countries

World map showing CHANG CHIEN-WEIs patent filings in countries

Patent filings per year

Chart showing CHANG CHIEN-WEIs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Chang Chien-Wei 27
#2 Lin Ting-Hao 16
#3 Lu Yu-Te 8
#4 Hennessy Lori 4
#5 Chen Ya-Hsiang 3
#6 Yang Chen-Ping 2
#7 Ma Cheng-Kuo 2
#8 Hennessy Lori K 2
#9 Wang Dennis 2
#10 Mulero Julio 1

Latest patents

Publication Filing date Title
US8312624B1 Method for manufacturing a heat dissipation structure of a printed circuit board
US2011306505A1 X-STR multiplex PCR amplification system
US2012228011A1 Semiconductor Load Board
US2011048777A1 Component-Embedded Printed Circuit Board
US2010015621A1 Method for direct amplification from crude nucleic acid samples
US2010309608A1 Buried Capacitor Structure
US2010283145A1 Stack structure with copper bumps
US2010075495A1 Method Of Selectively Plating Without Plating Lines
US2010075497A1 Non-Plating Line Plating Method Using Current Transmitted From Ball Side
US2010036988A1 Multimedia playing device
US2009308527A1 Method For Fabricating Circuit Trace On Core Board Having Buried Hole
US2009294052A1 Method for fabricating component-embedded printed circuit board
US2009008766A1 High-Density Fine Line Structure And Method Of Manufacturing The Same
US2009001547A1 High-Density Fine Line Structure And Method Of Manufacturing The Same
US2009001603A1 High-density fine line structure and method of manufacturing the same
US2008303150A1 High-Density Fine Line Structure And Method Of Manufacturing The Same
US2008286772A1 Method for direct amplification from crude nucleic acid samples
US2008185739A1 Semiconductor Substrate Having Enhanced Adhesion And Method For Manufacturing The Same
US2006030069A1 Packaging method for manufacturing substrates