|
US6297654B1
|
|
Test socket and method for testing an IC device in a dead bug orientation
|
|
US6559665B1
|
|
Test socket for an IC device
|
|
US6426637B1
|
|
Alignment guide and signal transmission apparatus and method for spring contact probe needles
|
|
US6354859B1
|
|
Cover assembly for an IC socket
|
|
US6114869A
|
|
Method and apparatus for interfacing between automatic wafer probe machines, automatic testers, and probe cards
|
|
US6220870B1
|
|
IC chip socket and method
|
|
US6208155B1
|
|
Probe tip and method for making electrical contact with a solder ball contact of an integrated circuit device
|
|
US6002426A
|
|
Inverted alignment station and method for calibrating needles of probe card for probe testing of integrated circuits
|
|
US5923178A
|
|
Probe assembly and method for switchable multi-DUT testing of integrated circuit wafers
|
|
US5828226A
|
|
Probe card assembly for high density integrated circuits
|
|
US5382898A
|
|
High density probe card for testing electrical circuits
|
|
US5066907A
|
|
Probe system for device and circuit testing
|
|
WO8000101A1
|
|
Probe and interface device for integrated circuit wafers
|
|
US4161692A
|
|
Probe device for integrated circuit wafers
|
