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SOLID STATE MEASUREMENTS INC

Overview
  • Total Patents
    121
About

SOLID STATE MEASUREMENTS INC has a total of 121 patent applications. Its first patent ever was published in 1975. It filed its patents most often in United States, EPO (European Patent Office) and Taiwan. Its main competitors in its focus markets measurement, semiconductors and chemical engineering are TF EA INC, TESTMETRIX INC and HAGENUK KMT KABELMESSTECHNIK GMBH.

Patent filings per year

Chart showing SOLID STATE MEASUREMENTS INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Hillard Robert J 44
#2 Howland William H 29
#3 Mazur Robert G 23
#4 Howland William H Jr 19
#5 Howland Jr William H 16
#6 Alexander William J 9
#7 Stephenson Robert C 8
#8 Bobrzynski Brian R 7
#9 Hartford Catherine L 5
#10 Rogers John R 5

Latest patents

Publication Filing date Title
US2008290889A1 Method of destructive testing the dielectric layer of a semiconductor wafer or sample
TW200804834A Method for determining the electrically active dopant density profile in ultra-shallow junction (USJ) structures
US2007109007A1 Elastic metal gate MOS transistor for surface mobility measurement in semiconductor materials
US2006087305A1 Method and system for measurement of sidewall damage in etched dielectric structures using a near field microwave probe
US2007046310A1 Method and system for automatically determining electrical properties of a semiconductor wafer or sample
US2005230619A1 Method and system for measurement of dielectric constant of thin films using a near field microwave probe
US2005225345A1 Method of testing semiconductor wafers with non-penetrating probes
US2006219658A1 Method of measuring semiconductor wafers with an oxide enhanced probe
US2006097740A1 In-situ wafer and probe desorption using closed loop heating
US2006068514A1 Method of detecting un-annealed ion implants
US2006066323A1 Method and apparatus for determining concentration of defects and/or impurities in a semiconductor wafer
US2005287684A1 Apparatus and method for detecting soft breakdown of a dielectric layer of a semiconductor wafer
US2005287683A1 Method and apparatus for determining generation lifetime of product semiconductor wafers
US2005253618A1 Work function controlled probe for measuring properties of a semiconductor wafer and method of use thereof
US2005241175A1 Method and apparatus for removing and/or preventing surface contamination of a probe
US2005146348A1 Method and apparatus for determining the dielectric constant of a low permittivity dielectric on a semiconductor wafer
US2005095728A1 Method of electrical characterization of a silicon-on-insulator (SOI) wafer
US6879176B1 Conductance-voltage (gv) based method for determining leakage current in dielectrics
US2005028836A1 Semiconductor substrate surface preparation using high temperature convection heating
US2004251923A1 Flexible membrane probe and method of use thereof