CELERITY RES INC has a total of 17 patent applications. Its first patent ever was published in 2003. It filed its patents most often in United States, Taiwan and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets measurement, semiconductors and computer technology are TRANSLARITY INC, ADVANCED INQUIRY SYSTEMS INC and MICROELECTONICS TECHNOLOGY INC.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 7 | |
#2 | Taiwan | 3 | |
#3 | WIPO (World Intellectual Property Organization) | 3 | |
#4 | China | 2 | |
#5 | EPO (European Patent Office) | 2 |
# | Industry | |
---|---|---|
#1 | Measurement | |
#2 | Semiconductors | |
#3 | Computer technology | |
#4 | Machines |
# | Technology | |
---|---|---|
#1 | Measuring electric variables | |
#2 | Semiconductor devices | |
#3 | Static stores | |
#4 | Unspecified technologies |
# | Name | Total Patents |
---|---|---|
#1 | Diorio Mark L | 11 |
#2 | Nguyen Tom T | 4 |
#3 | Karavakis Konstantine N | 4 |
#4 | Diorio Mark | 1 |
#5 | Dean Vada W | 1 |
#6 | Hilton Robert M | 1 |
#7 | Dean Vada | 1 |
Publication | Filing date | Title |
---|---|---|
US2005289415A1 | Intelligent probe chips/heads | |
TW200425374A | Device probing using a matching device | |
TW200425373A | Planarizing and testing of BGA packages | |
US6984996B2 | Wafer probing that conditions devices for flip-chip bonding | |
US2004177996A1 | Probe structures using clamped substrates with compliant interconnectors | |
US2004179343A1 | Structures for testing circuits and methods for fabricating the structures | |
US2004178812A1 | Connecting a probe card and an interposer using a compliant connector |