| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Japan | 5 | |
| #2 | Taiwan | 4 | |
| #3 | United States | 3 | |
| #4 | China | 2 | |
| #5 | Singapore | 2 | |
| #6 | WIPO (World Intellectual Property Organization) | 2 | |
| #7 | Malaysia | 1 |
| # | Industry | |
|---|---|---|
| #1 | Measurement | |
| #2 | Semiconductors | |
| #3 | Packaging and shipping |
| # | Technology | |
|---|---|---|
| #1 | Measuring electric variables | |
| #2 | Transport or storage devices | |
| #3 | Semiconductor devices |
| # | Name | Total Patents |
|---|---|---|
| #1 | Aihara Takamitsu | 16 |
| #2 | So Vincent | 7 |
| #3 | Maruyama Tomohisa | 4 |
| #4 | Vincent So | 2 |
| #5 | Takamitsu Aihara | 2 |
| #6 | Ohno Tomonori | 1 |
| #7 | Kurihara Mitsugu | 1 |
| Publication | Filing date | Title |
|---|---|---|
| JP2020112468A | Contactor and handler | |
| JP2020101448A | handler | |
| JP2017125860A | Electronic component conveying apparatus | |
| JP2015212676A | Contact module for measuring electronic component | |
| JP2014238321A | Transport device of electronic component | |
| MY120838A | Method of controlling ic handler and control system using the same |