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Coolant drip facilitating partial immersion-cooling of electronic components
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Vapor condenser with three-dimensional folded structure
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Thermoelectric-enhanced air and liquid cooling of an electronic system
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Direct facility coolant cooling of a rack-mounted heat exchanger
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Thermal resistance-based monitoring of cooling of an electronic component
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Calibrated airflow sensor facilitating monitoring of electronic system cooling
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Multi-rack assembly with shared cooling apparatus
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Multi-rack assembly with shared cooling unit
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Wicking vapor-condenser facilitating immersion-cooling of electronic component(s)
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Coolant manifold with separately rotatable manifold section(s)
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Multi-fluid, two-phase immersion-cooling of electronic component(s)
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Dry-cooling unit with gravity-assisted coolant flow
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Thermoelectric-enhanced, vapor-condenser facilitating immersion-cooling of electronic component(s)
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Thermal expansion-enhanced heat sink for an electronic assembly
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Contaminant cold trap for a vapor-compression refrigeration apparatus
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Combined power and cooling rack supporting an electronics rack(S)
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Intra-condenser contaminant extractor for a vapor-compression refrigeration apparatus
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Contaminant separator for a vapor-compression refrigeration apparatus
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Heat sink structure with a vapor-permeable membrane for two-phase cooling
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Flow boiling heat sink structure with vapor venting and condensing
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