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BONDOTEKKU KK

Overview
  • Total Patents
    20
About

BONDOTEKKU KK has a total of 20 patent applications. Its first patent ever was published in 2003. It filed its patents most often in Japan. Its main competitors in its focus markets semiconductors, optics and machine tools are SEMI PHOTONICS CO LTD, CASEM ASIA PTE LTD and DONGGUAN HCP TECH CO LTD.

Patent filings in countries

World map showing BONDOTEKKU KKs patent filings in countries
# Country Total Patents
#1 Japan 20

Patent filings per year

Chart showing BONDOTEKKU KKs patent filings per year from 1900 to 2020

Focus industries

Top inventors

# Name Total Patents
#1 Okada Masuaki 20
#2 Nakai Seiya 4
#3 Kuwauchi Shigeki 4
#4 Suga Tadatomo 2
#5 Yamauchi Akira 1

Latest patents

Publication Filing date Title
JP2006222436A Bonding method, and device created by the method and bonding apparatus
JP2006156970A Resonator for ultrasonic jointing
JP2006116602A Parallelism regulating method and device for pressurizing apparatus
JP2006121061A Method and device for applying vibration and pressure
JP2005294824A Ultrasonic joining method and ultrasonic joining device in vacuum
JP2005293570A Creep correction method and device in drive mechanism using piezoelectric element
JP2005268766A Individual cleaning method and apparatus
JP2005311298A Joining method, and device and apparatus formed by method
JP2005191556A Method and apparatus for gas-filled gold bonding
JP2005187321A Bonding method, device produced by this method, and bonding device
JP2005294800A Joining method, device created thereby, surface activating device and joining device provided therewith
JP2005138181A Ultrasonic vibration control method and apparatus
JP2005138182A Ultrasonic vibration joining method and apparatus
JP2005142537A Longitudinal vibration bonding method and device
JP2006073780A Normal-temperature joint method, equipment, and device
JP2005236166A Piezo alignment system
JP2005236165A Piezo bonding table
JP2005229005A Ultrasonic bonding method and apparatus in vacuum
JP2005229006A Individual aligning method and apparatus thereof
JP2005181789A Packaging method and packaging apparatus for large-sized flat display panel