| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Japan | 17 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Machines | |
| #3 | Audio-visual technology | |
| #4 | Electrical machinery and energy |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Unspecified technologies | |
| #3 | Casings and printed circuits | |
| #4 | Resistors |
| # | Name | Total Patents |
|---|---|---|
| #1 | Son Seo Ho | 12 |
| #2 | Chuang Chih-Hong | 2 |
| #3 | Dai Wei-Lun | 1 |
| #4 | Wu Jian Hong | 1 |
| #5 | Shen Tzu Shih | 1 |
| #6 | Chin Chang-Bo | 1 |
| #7 | Ho Wen Cheng | 1 |
| #8 | Wang Chin-Sheng | 1 |
| #9 | Huang Tzu-Wei | 1 |
| Publication | Filing date | Title |
|---|---|---|
| JP2011061021A | Non-cylindrical via-structure and heat transfer accelerating substrate having the via-structure |