CHEN SHIH-CHI has a total of 11 patent applications. Its first patent ever was published in 2007. It filed its patents most often in Taiwan, United States and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, audio-visual technology and machines are IMBERA ELECTRONICS OY, KYOKUTOKU KAGI KOFUN YUGENKOSHI and WORLD WISER ELECTRONICS INC.
# | Country | Total Patents | |
---|---|---|---|
#1 | Taiwan | 6 | |
#2 | United States | 4 | |
#3 | WIPO (World Intellectual Property Organization) | 1 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Audio-visual technology | |
#3 | Machines | |
#4 | Computer technology | |
#5 | Measurement | |
#6 | Medical technology | |
#7 | Agriculture |
# | Name | Total Patents |
---|---|---|
#1 | Chen Shih-Chi | 11 |
#2 | Zhang Zihao | 1 |
#3 | Culpepper Martin L | 1 |
#4 | Culpepper Martin | 1 |
#5 | Shyu Jenq-Huey | 1 |
Publication | Filing date | Title |
---|---|---|
US2013104604A1 | Yarn feeding apparatus for circular knitting machines | |
US2011316993A1 | Oscillating microtome with flexure drive | |
TW201013866A | Flip board package and the forming method thereof | |
TW200941698A | Structure of chip package stacked | |
TW200941699A | Stacked structure of package chip | |
TW200941608A | Tester for wafer testing | |
TW200939425A | Multi-chip module package structure and the method thereof | |
TW200926316A | Semiconductor package and method thereof |