ASPOCOMP TECHNOLOGY OY has a total of 16 patent applications. Its first patent ever was published in 2004. It filed its patents most often in Finland, EPO (European Patent Office) and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets audio-visual technology, optics and semiconductors are PPC ELECTRONIC AG, HONGQISHENG PREC ELECTRONICS (QINHUANGDAO) CO LTD and AT & S AUSTRIA TECH & SYSTEMTECHNIK AG.
# | Country | Total Patents | |
---|---|---|---|
#1 | Finland | 7 | |
#2 | EPO (European Patent Office) | 4 | |
#3 | WIPO (World Intellectual Property Organization) | 4 | |
#4 | United States | 1 |
# | Industry | |
---|---|---|
#1 | Audio-visual technology | |
#2 | Optics | |
#3 | Semiconductors | |
#4 | Telecommunications |
# | Technology | |
---|---|---|
#1 | Casings and printed circuits | |
#2 | Optical systems | |
#3 | Semiconductor devices | |
#4 | Transmission | |
#5 | Devices using light amplification |
# | Name | Total Patents |
---|---|---|
#1 | Hietala Joni | 6 |
#2 | Hagberg Juha | 5 |
#3 | Von Lerber Tuomo | 4 |
#4 | Muukkonen Esa | 4 |
#5 | Peltola Tero | 4 |
#6 | Loisa Juulia | 4 |
#7 | Kutilainen Terho | 2 |
#8 | Kauma Kari | 2 |
#9 | Paaso Jaska | 2 |
#10 | Mettovaara Janne | 2 |
Publication | Filing date | Title |
---|---|---|
FI20065205A0 | Method and apparatus for manufacturing a switching substrate and for embedding a component | |
FI20055660A0 | Method and apparatus for making a terminal block and recessing a component | |
FI20055606A0 | Laminate structure, method of manufacturing the laminate structure and apparatus for manufacturing the laminate structure | |
FI20045501A0 | Wiring patterns, wiring harness and method for making wiring patterns and wiring harnesses | |
FI20045412A0 | Printed circuit board, process for its manufacture and electronic device | |
FI20041233A0 | Method for assembling the optoelectronic module and the structure of the optoelectronic module | |
FI20045179A0 | Printed circuit board, manufacturing method and electronic device |