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APTOS TECHNOLOGY INC

Overview
  • Total Patents
    35
  • GoodIP Patent Rank
    200,647
About

APTOS TECHNOLOGY INC has a total of 35 patent applications. Its first patent ever was published in 2009. It filed its patents most often in Taiwan, China and United States. Its main competitors in its focus markets audio-visual technology, semiconductors and computer technology are SAMSUNG SEMICONDUCTOR (CHINA) R&D CO LTD, BARUN ELECTRONICS CO LTD and WATANABE KENICHI.

Patent filings in countries

World map showing APTOS TECHNOLOGY INCs patent filings in countries
# Country Total Patents
#1 Taiwan 18
#2 China 6
#3 United States 5
#4 Japan 4
#5 EPO (European Patent Office) 2

Patent filings per year

Chart showing APTOS TECHNOLOGY INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Jow En-Min 9
#2 Hung Chia-Chun 8
#3 Lo Chi-Jang 3
#4 Jow En Min 3
#5 Yang Tsung-Yen 2
#6 Lv Jianxian 2
#7 Lin Nan-Chun 2
#8 Lo Chi Jang 2
#9 Lu Chien-Hsien 2
#10 Lin Guohua 2

Latest patents

Publication Filing date Title
US2016142801A1 Flexible electroacoustic apparatus and wearable electronic product capable of processing audio signals using the same
CN104282578A Method for manufacturing an embedded package and structure thereof
TW201503509A Method for manufacturing embedded package and structure thereof
TW201426985A Optoelectronic package and method of manufacturing the same
TW201306191A Package structure and package process
TW201311081A Manufacturing method for electroplating of packaged electronic device and electroplating fixture thereof
TW201308766A Electronic device and the manufacturing method thereof
TW201305856A Projection system and image processing method thereof
TW201306184A Package structure and manufacturing method thereof
TW201228863A Vehicle recording apparatus
TW201230805A Video playback apparatus and method
TW201223803A Vehicle recording apparatus and image recording method
TW201212170A Package structure for memory card and method for fabricating the same
TW201140664A Method for acquiring recycled chips and method for fabricating semiconductor package
TW201138038A Quad flat no-lead package, method for forming the same, and metal plate for forming the package
US2010225458A1 Bicycle burglarproof device
TW201043990A Bird tracing device, station and bird tracing system thereof
TW201043989A Pet positioning device, pet monitoring device and pet tracking system thereof
TW201044470A Package substrate manufacturing method and its structure
CN101876695A GPS recording device