|
WO9611105A1
|
|
Thermal management for additive printed circuits
|
|
US5256441A
|
|
Ductile copper
|
|
US5258200A
|
|
Electroless copper deposition
|
|
US5178988A
|
|
Photoimageable permanent resist
|
|
EP0460548A2
|
|
Printed circuits and base materials precatalyzed for etal deposition
|
|
US5264065A
|
|
Printed circuits and base materials having low Z-axis thermal expansion
|
|
US5109479A
|
|
Method of designing three dimensional electrical circuits
|
|
US5070002A
|
|
Photoimageable permanent resist
|
|
US5047114A
|
|
Process for the production of metal clad thermoplastic base materials and printed circuits on thermoplastic base materials
|
|
US5008619A
|
|
Multilevel circuit board precision positioning
|
|
KR960008311B1
|
|
Moulded metallized plastic articles and process for making the same
|
|
EP0471386A2
|
|
Process for the preparation of conductive patterns on thermoplastic polymer base substrates
|
|
US4981725A
|
|
Process and composition for sensitizing articles for metallization
|
