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FUKUI PREC COMPONENTS SHENZHEN

Overview
  • Total Patents
    16
About

FUKUI PREC COMPONENTS SHENZHEN has a total of 16 patent applications. Its first patent ever was published in 2008. It filed its patents most often in China. Its main competitors in its focus markets audio-visual technology, semiconductors and basic materials chemistry are VIASYSTEMS INC, AMP AKZO CORP and PLOTECH TECH KUNSHAN CO LTD.

Patent filings in countries

World map showing FUKUI PREC COMPONENTS SHENZHENs patent filings in countries
# Country Total Patents
#1 China 16

Patent filings per year

Chart showing FUKUI PREC COMPONENTS SHENZHENs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Chengxian Lin 8
#2 Yaowen Bai 4
#3 Xingze Liu 3
#4 Rui Zhang 3
#5 Daoming Liao 2
#6 Kai Liao 2
#7 Wencun Chen 2
#8 Qinghong Bi 2
#9 Xinzhi Liao 2
#10 Jiahong Shen 2

Latest patents

Publication Filing date Title
CN101770227A Assembly line monitoring control device, monitoring control method and assembly line
CN101662881A Circuit board and manufacturing method thereof
CN101662895A Multilayer circuit board, manufacturing method thereof and method for detecting alignment of circuit board
CN101640979A Manufacturing method of conducting circuit
CN101640976A Manufacturing method of flexible circuit board
CN101636043A Method for manufacturing electric conduction line
CN101621894A Circuit board assembling method and circuit board prefabricated product
CN101620383A Oven and baking method
CN101616546A Bearing platform
CN101600301A Circuit board and preparation method thereof
CN101594752A The manufacture method of multilayer circuit board
CN101591488A Printing ink and utilize the method for this printing ink to manufacture electric conduction line
CN101576418A Electroplating bath solution temperature detection device
CN101574815A Copper foil base material cutting device
CN101524732A Die with functions of nibbling and blanking and device comprising same
CN101521992A Method for forming solder performs on welding spots of a circuit substrate and flip-chip method