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Additives to stop copper attack by alkaline etching agents such as ammonia and monoethanol amine (MEA)
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Method to improve the stability of dispersions of carbon
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Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates
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Printed wiring boards and methods for making them
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Method to improve the stability of dispersions of carbon
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Permanganate desmear process for printed wiring boards
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Direct metallization process employing a cationic conditioner and a binder
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Method for roughening copper surfaces for bonding to substrates
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Conditioning of through holes and glass
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Aqueous carbon composition and method for coating a non conductive substrate
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Permanganate desmear process for printed wiring boards
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Direct metallization process
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Ultrasonic mixing of through hole treating compositions
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Carbon containing composition for electroplating
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Direct metallization process
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Processes for preparing a non-conductive substrate for electroplating
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Method for treating an oxidized copper film
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Composition and process for preparing a non-conductive substrate for electroplating
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Process for improved adhesion between a metallic oxide and a polymer surface
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Improved method for bonding copper to a polymeric material
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