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ELECTROCHEMICALS INC

Overview
  • Total Patents
    61
About

ELECTROCHEMICALS INC has a total of 61 patent applications. Its first patent ever was published in 1991. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and Taiwan. Its main competitors in its focus markets audio-visual technology, surface technology and coating and basic materials chemistry are SHENZHEN BOMIN ELECTRONIC CO LTD, VIASYSTEMS INC and FUKUI PREC COMPONENTS SHENZHEN.

Patent filings per year

Chart showing ELECTROCHEMICALS INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Polakovic Frank 31
#2 Carano Michael V 16
#3 Mosolf Charles A 13
#4 Thorn Charles Edwin 13
#5 Bernards Roger F 10
#6 Kucera Al 6
#7 Gonzalez Hector 6
#8 Schanhaar Mike 6
#9 Bernards Roger 6
#10 Bowers Joseph S Jr 5

Latest patents

Publication Filing date Title
US7211204B2 Additives to stop copper attack by alkaline etching agents such as ammonia and monoethanol amine (MEA)
GB0519687D0 Method to improve the stability of dispersions of carbon
US6716281B2 Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates
US6710259B2 Printed wiring boards and methods for making them
US6623787B2 Method to improve the stability of dispersions of carbon
US6454868B1 Permanganate desmear process for printed wiring boards
US6303181B1 Direct metallization process employing a cationic conditioner and a binder
US7351353B1 Method for roughening copper surfaces for bonding to substrates
US6375731B1 Conditioning of through holes and glass
US6440331B1 Aqueous carbon composition and method for coating a non conductive substrate
US5985040A Permanganate desmear process for printed wiring boards
US6171468B1 Direct metallization process
EP0877713A1 Ultrasonic mixing of through hole treating compositions
US5725807A Carbon containing composition for electroplating
US5690805A Direct metallization process
US5476580A Processes for preparing a non-conductive substrate for electroplating
US5492595A Method for treating an oxidized copper film
US5389270A Composition and process for preparing a non-conductive substrate for electroplating
WO9310652A1 Process for improved adhesion between a metallic oxide and a polymer surface
WO9310277A1 Improved method for bonding copper to a polymeric material