| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 9 | |
| #2 | EPO (European Patent Office) | 4 | |
| #3 | Taiwan | 3 | |
| #4 | China | 2 | |
| #5 | WIPO (World Intellectual Property Organization) | 2 | |
| #6 | Republic of Korea | 1 |
| # | Industry | |
|---|---|---|
| #1 | Audio-visual technology | |
| #2 | Machines | |
| #3 | Surface technology and coating | |
| #4 | Semiconductors | |
| #5 | Macromolecular chemistry and polymers |
| # | Name | Total Patents |
|---|---|---|
| #1 | Bahl Kenneth S | 21 |
| #2 | Karavakis Konstantine | 18 |
| #3 | Carney Steve | 4 |
| #4 | Karavakas Konstantine | 1 |
| Publication | Filing date | Title |
|---|---|---|
| TW202102719A | Catalytic laminate with conductive traces formed during lamination | |
| US2020214144A1 | Multi-Layer Circuit Board with Traces Thicker than a Circuit Board Layer | |
| US2016148893A1 | Method for wafer level packaging | |
| TW201607395A | Embedded traces | |
| CN111970841A | Embedded traces |