VIASYSTEMS INC has a total of 12 patent applications. Its first patent ever was published in 1999. It filed its patents most often in EPO (European Patent Office), WIPO (World Intellectual Property Organization) and Republic of Korea. Its main competitors in its focus markets audio-visual technology, surface technology and coating and electrical machinery and energy are PLOTECH TECH KUNSHAN CO LTD, SICHUAN HAIYING ELECTRONIC TECHNOLOGY CO LTD and FUKUI PREC COMPONENTS SHENZHEN.
# | Country | Total Patents | |
---|---|---|---|
#1 | EPO (European Patent Office) | 3 | |
#2 | WIPO (World Intellectual Property Organization) | 3 | |
#3 | Republic of Korea | 2 | |
#4 | United States | 2 | |
#5 | Australia | 1 | |
#6 | Hong Kong | 1 |
# | Industry | |
---|---|---|
#1 | Audio-visual technology | |
#2 | Surface technology and coating | |
#3 | Electrical machinery and energy | |
#4 | Machines |
# | Technology | |
---|---|---|
#1 | Casings and printed circuits | |
#2 | Coating metallic material | |
#3 | Electrically-conductive connections | |
#4 | Unspecified technologies |
# | Name | Total Patents |
---|---|---|
#1 | Miscikowski Pamela L | 5 |
#2 | Lecesse Roy J | 4 |
#3 | Parker John Leroy Jr | 3 |
#4 | Sorensen Adam | 3 |
#5 | Lewis Bruce | 3 |
#6 | Parker Jr John Leroy | 1 |
#7 | Parker Jr John L | 1 |
Publication | Filing date | Title |
---|---|---|
KR20150030743A | Circuit board multi-functional hole system and method | |
KR20130136995A | Method of manufacturing printed circuit boards having vias with wrap plating | |
US6598291B2 | Via connector and method of making same | |
US6303881B1 | Via connector and method of making same | |
AU3210999A | A via connector and method of making same |