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LAVOIE ADRIEN R

Overview
  • Total Patents
    15
About

LAVOIE ADRIEN R has a total of 15 patent applications. Its first patent ever was published in 2006. It filed its patents most often in United States. Its main competitors in its focus markets semiconductors, surface technology and coating and electrical machinery and energy are ASM INT NV, WEIDMAN TIMOTHY W and CLARK ROBERT D.

Patent filings in countries

World map showing LAVOIE ADRIEN Rs patent filings in countries
# Country Total Patents
#1 United States 15

Patent filings per year

Chart showing LAVOIE ADRIEN Rs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Lavoie Adrien R 15
#2 Dominguez Juan E 7
#3 Han Joseph H 4
#4 Plombon John J 4
#5 Simka Harsono S 4
#6 Budrevich Aaron A 3
#7 Dubin Valery M 2
#8 Barrow Bill 1
#9 Baum Thomas H 1
#10 Hendrix Bryan C 1

Latest patents

Publication Filing date Title
US2012074571A1 Methods and architectures for bottomless interconnect vias
US2009321934A1 Self-aligned cap and barrier
US2009160055A1 IC solder reflow method and materials
US2010283570A1 Nano-encapsulated magnetic particle composite layers for integrated silicon voltage regulators
US2012286372A1 Reliability of high-K gate dielectric layers
US2008223287A1 Plasma enhanced ALD process for copper alloy seed layers
US2008160204A1 Spontaneous copper seed deposition process for metal interconnects
US2008132050A1 Deposition process for graded cobalt barrier layers
US2007205510A1 Noble metal barrier layers
US2008045013A1 Iridium encased metal interconnects for integrated circuit applications
US2007281476A1 Methods for forming thin copper films and structures formed thereby
US2007269981A1 Electroless treatment of noble metal barrier and adhesion layer
US2007264816A1 Copper alloy layer for integrated circuit interconnects
US2007207611A1 Noble metal precursors for copper barrier and seed layer