| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 11 | |
| #2 | Japan | 2 | |
| #3 | Germany | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Audio-visual technology | |
| #3 | Measurement | |
| #4 | Machines | |
| #5 | Materials and metallurgy |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Casings and printed circuits | |
| #3 | Measuring light | |
| #4 | Unspecified technologies | |
| #5 | Unspecified technologies | |
| #6 | Metal tempering |
| # | Name | Total Patents |
|---|---|---|
| #1 | Yamazaki Takao | 13 |
| #2 | Sano Masahiko | 4 |
| #3 | Kurashina Seiji | 3 |
| #4 | Sogawa Yoshimichi | 3 |
| #5 | Masuda Shizuaki | 3 |
| #6 | Suzuki Katsuhiko | 2 |
| #7 | Murakami Tomoo | 1 |
| #8 | Nishiyama Tomohiro | 1 |
| #9 | Watanabe Shinji | 1 |
| #10 | Kurashima Seiji | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US2011031610A1 | Semiconductor device | |
| US2011114840A1 | Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating package | |
| US2010188821A1 | Device having electronic components mounted therein and method for manufacturing such device | |
| US2010246144A1 | Electronic device package, module, and electronic device | |
| JPH1099042A | Molded food containing oyster mushroom |