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GB201912344D0
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CMOS wavefront sensors
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DE102019118270A1
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Process for the production of semiconductor components to increase the yield in microtransfer printing
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GB201909183D0
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Single photon avalanche diode devices
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DE102019116019A1
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Production of components in substrates via a multi-stage etching process
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DE102019110922A1
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Trench isolation structure with enlarged electrically conductive side wall
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GB201905789D0
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Semiconductor device for light detection
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DE102019108334A1
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ESD protective component and MOS transistor with (at least) one integrated ESD protective component
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DE102019106861A1
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PROGRAMMABLE READ-ONLY MEMORY DEVICE
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DE102018125378B3
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Anodic bonding of a glass substrate with contact bushings to a silicon substrate
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GB201813179D0
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A semiconductor structure
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GB202014914D0
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Improvements in lens layers for semiconductor devices
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GB201813110D0
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Improvements in lens layers for semiconductor devices
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GB201811530D0
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Improvements in and relating to flash memory
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GB201810383D0
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Anti-reflective layers in semiconductor devices
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GB201810251D0
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Substrates for III-nitride epitaxy
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DE102018105752A1
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Electrically modulated photodiode and method for its production
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GB201800900D0
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Ohmic contacts in semiconductor devices
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GB201713530D0
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Noff III-nitride high electron mobility transistor
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US2017294351A1
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Electrically conductive via(s) in a semiconductor substrate and associated production method
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GB201610660D0
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Thermopile Test Structure And Methods Employing Same
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