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Bonded three-dimensional memory device and method of forming the same
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Memory device providing bad column repair and method of operating the same
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For improving the page of 3D NAND or channel hole and bit-line architecture and the method for block size and performance
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Memory device and the method for forming memory device
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The evaluating method of ion implantation concentration detection method and different ions board ion implantation concentration uniformity
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The method that directs study of copper fill process is carried out to groove and hole
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Semiconductor making method
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A kind of preparation process of metal interconnection structure
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A kind of autoregistration quadruple graph technology
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A kind of preparation process of metal interconnection structure
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One kind is used for the pinpoint method of interdigitated grid GOI structure leakage point of electricity
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A kind of lithography alignment method for photolithographic patterning process
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The construction method of the step contact hole of 3D nand flash memories
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Three-dimensional storage forming method
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A kind of cleaning method after multi crystal silicon chemical mechanical milling
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The preparation method of fleet plough groove isolation structure
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Method, semi-conductor device manufacturing method
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Three-dimensional storage organization bus connection method, storage organization, memory and electronic equipment
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CN107994032A
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Prevent the method and structure that peripheral circuit is damaged
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Silicon wafer warpage state adjustment method
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