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WORLD METAL KK

Overview
  • Total Patents
    29
  • GoodIP Patent Rank
    215,664
  • Filing trend
    ⇩ 100.0%
About

WORLD METAL KK has a total of 29 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 1980. It filed its patents most often in Japan. Its main competitors in its focus markets semiconductors, audio-visual technology and electrical machinery and energy are GONG ZHIWEI, NISHIMURA TAKAO and SHIM IL KWON.

Patent filings in countries

World map showing WORLD METAL KKs patent filings in countries
# Country Total Patents
#1 Japan 29

Patent filings per year

Chart showing WORLD METAL KKs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Hayashida Hidenori 28
#2 Ueda Shigeaki 8
#3 Miyata Seiichiro 8
#4 Tsuchiya Shoji 4
#5 Yamaguchi Fumio 1
#6 Kobayashi Riyouji 1
#7 Yugawa Yoshiharu 1
#8 Hayashida Hiroyuki 1
#9 Sagami Yosuke 1
#10 Yoshimoto Toshikuni 1

Latest patents

Publication Filing date Title
JP2019037969A Moving metals such as boron and methoxy metal from plating drainage
JP2015135933A Multilayer wiring board and manufacturing method thereof
JP2001232569A Electrodeposition tool
JP2001232570A Electrodeposition tool and manufacturing method thereof
JP2001107260A Electrodepositing tool
JPH11343577A Nickel-base plated substrate
JP2000012605A Method for producing electrode part of semiconductor chip
JPH10287994A Plating structure of bonding part
JPH10189001A Manufacturer of positive electrode for secondary cell
JPH09283557A Method of electrical connection of electronic element chip to interconnection circuit
JPH08293654A Formation of metal film on ceramic base material and metal-coated ceramic structure
JPH08191073A Ball and method for bonding semiconductor chip
JPH08171954A Contact point material and contact point member using it
JPH08139097A Flip chip use connection ball and bonding of semiconductor chip
JPH08130227A Semiconductor chip, forming method of semiconductor chip terminal, and bonding method of semiconductor chips
JPH08130221A Bump forming method of semiconductor chip and mounting method of semiconductor chip
JPH07183327A Semiconductor chip, formation of terminal thereon and bonding method thereof
JPH07263493A Chip mounting method
JPH046896A Ceramic wiring board
JPH0369580A Metallizing method for ceramics