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WANG CHUNG YU

Overview
  • Total Patents
    13
About

WANG CHUNG YU has a total of 13 patent applications. Its first patent ever was published in 1917. It filed its patents most often in United States and Taiwan. Its main competitors in its focus markets semiconductors, materials and metallurgy and environmental technology are SHENZHEN BASIC SEMICONDUCTOR LTD, STAHNSDORF GLEICHRICHTER and DAHENG SCIENCE & TECHNOLOGY CO LTD.

Patent filings in countries

World map showing WANG CHUNG YUs patent filings in countries
# Country Total Patents
#1 United States 12
#2 Taiwan 1

Patent filings per year

Chart showing WANG CHUNG YUs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Wang Chung Yu 13
#2 Lin Jing-Cheng 3
#3 Lu Szu Wei 2
#4 Yeh Kung-Chen 2
#5 Wu Chih-Wei 2
#6 Syu Shih-Yi 2
#7 Wang Jiann-Jong 1
#8 Liu Hsien-Wen 1
#9 Chen Chih-Hao 1
#10 Tsao Pei-Haw 1

Latest patents

Publication Filing date Title
US2013217188A1 Structures and formation methods of packages with heat sinks
US2013122689A1 Methods for de-bonding carriers
TW201233782A A solar cell with a fluorescent powder and a method for making the same
US2013075937A1 Apparatus and methods for molding die on wafer interposers
US2013009316A1 Apparatus and methods for dicing interposer assembly
US2011230043A1 Tape residue-free bump area after wafer back grinding
US2011215361A1 Thermally-enhanced hybrid LED package components
US2011215360A1 LED flip-chip package structure with dummy bumps
US2011215354A1 Double flip-chip LED package components
US2011198638A1 Light-emitting diode (LED) package systems
US2011193056A1 Vertical LED chip package on TSV carrier
US2009130840A1 Protected solder ball joints in wafer level chip-scale packaging
US1284164A Starring mixture for antimony-smelting.