Learn more

SHANGHAI FINE CHIP SEMICONDUCTOR CO LTD

Overview
  • Total Patents
    21
  • GoodIP Patent Rank
    78,363
  • Filing trend
    ⇧ 200.0%
About

SHANGHAI FINE CHIP SEMICONDUCTOR CO LTD has a total of 21 patent applications. It increased the IP activity by 200.0%. Its first patent ever was published in 2014. It filed its patents most often in China. Its main competitors in its focus markets semiconductors are PELLANT MICHAL, WAVESQUARE INC and SILICON SEMICONDUCTOR CORP.

Patent filings in countries

World map showing SHANGHAI FINE CHIP SEMICONDUCTOR CO LTDs patent filings in countries
# Country Total Patents
#1 China 21

Patent filings per year

Chart showing SHANGHAI FINE CHIP SEMICONDUCTOR CO LTDs patent filings per year from 1900 to 2020

Focus industries

# Industry
#1 Semiconductors

Focus technologies

# Technology
#1 Semiconductor devices

Top inventors

# Name Total Patents
#1 Huang Ping 17
#2 Bao Lihua 14
#3 Gu Haiying 9
#4 Yang Fanli 4
#5 Zhang Dixiong 3

Latest patents

Publication Filing date Title
CN111554640A Power semiconductor chip electrode structure applied to embedded substrate packaging and preparation method
CN111211081A Single-grain thinning back metallization method
CN111341755A Embedded substrate packaging structure of power device and preparation method
CN111312821A Power MOSFET with fin-shaped structure and preparation method thereof
CN110660765A CSP (chip scale package) packaging structure and CSP packaging method for triode separator
CN110676181A Diffusion type CSP packaging method
CN110429140A A kind of super node MOSFET structure and preparation method thereof
CN110416211A A kind of super-self-aligned power Trench MOSFET production method and structure
CN110098160A A kind of wafer-level packaging chip and preparation method thereof
CN109904109A A kind of isolation structure of bipolar integrated circuit and the forming method of isolation structure
CN109830434A A kind of thinning back side of silicon wafer method for metallising
CN109473362A A kind of CSP packaging method of power device
CN109166914A Field resistance type IGBT structure and preparation method thereof
CN109003905A A kind of packaging method of power device
CN107369611A Back side metallization technology is thinned in novel wafer
CN105826288A Chip scale packaging (CSP) structure of power device and manufacturing method of power device
CN105742173A Processing method for ultra-thin wafer
CN104241094A Machining method for preventing edge of ultra-thin silicon wafer from being broken
CN104347542A Five-side packaged CSP (chip scale package) structure and manufacturing process
CN104051369A Middle interconnection layer used for 2.5D packaging and manufacturing method thereof