Learn more

VLSI PACKAGING MATERIALS INC

Overview
  • Total Patents
    11
About

VLSI PACKAGING MATERIALS INC has a total of 11 patent applications. Its first patent ever was published in 1987. It filed its patents most often in WIPO (World Intellectual Property Organization), United States and Canada. Its main competitors in its focus markets materials and metallurgy and semiconductors are PANG QIQI, BIECK FLORIAN and KHAN ADAM.

Patent filings in countries

World map showing VLSI PACKAGING MATERIALS INCs patent filings in countries

Patent filings per year

Chart showing VLSI PACKAGING MATERIALS INCs patent filings per year from 1900 to 2020

Focus industries

Focus technologies

Top inventors

# Name Total Patents
#1 Finkelstein Leo 10
#2 Dumesnil Maurice E 10
#3 Tetschlag Richard R 4
#4 Kinkelstein Leo 1
#5 Dumisnil Maurice E 1

Latest patents

Publication Filing date Title
WO9310052A1 Low temperature sealing glass compositions
WO9302980A1 Low temperature lead vanadium sealing glass compositions
US4997718A Silver phosphate glass die-attach composition
US5013360A Sealing glass compositions
CA1294991C Low melting glass composition
EP0405622A2 Low melting glass composition
US4743302A Low melting glass composition