VLSI PACKAGING MATERIALS INC has a total of 11 patent applications. Its first patent ever was published in 1987. It filed its patents most often in WIPO (World Intellectual Property Organization), United States and Canada. Its main competitors in its focus markets materials and metallurgy and semiconductors are PANG QIQI, BIECK FLORIAN and KHAN ADAM.
# | Country | Total Patents | |
---|---|---|---|
#1 | WIPO (World Intellectual Property Organization) | 4 | |
#2 | United States | 3 | |
#3 | Canada | 2 | |
#4 | EPO (European Patent Office) | 2 |
# | Industry | |
---|---|---|
#1 | Materials and metallurgy | |
#2 | Semiconductors |
# | Technology | |
---|---|---|
#1 | Treatment of glass | |
#2 | Semiconductor devices |
# | Name | Total Patents |
---|---|---|
#1 | Finkelstein Leo | 10 |
#2 | Dumesnil Maurice E | 10 |
#3 | Tetschlag Richard R | 4 |
#4 | Kinkelstein Leo | 1 |
#5 | Dumisnil Maurice E | 1 |
Publication | Filing date | Title |
---|---|---|
WO9310052A1 | Low temperature sealing glass compositions | |
WO9302980A1 | Low temperature lead vanadium sealing glass compositions | |
US4997718A | Silver phosphate glass die-attach composition | |
US5013360A | Sealing glass compositions | |
CA1294991C | Low melting glass composition | |
EP0405622A2 | Low melting glass composition | |
US4743302A | Low melting glass composition |