ASTEC HALBLEITERTECHNOLOGIE GM has a total of 16 patent applications. Its first patent ever was published in 1995. It filed its patents most often in Germany, EPO (European Patent Office) and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, packaging and shipping and materials and metallurgy are GENESEM INC, KOREA SEMICINDUCTOR SYSTEM CO and SHINAPEX CO LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | Germany | 6 | |
#2 | EPO (European Patent Office) | 3 | |
#3 | WIPO (World Intellectual Property Organization) | 2 | |
#4 | Australia | 1 | |
#5 | China | 1 | |
#6 | Israel | 1 | |
#7 | United States | 1 | |
#8 | South Africa | 1 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Packaging and shipping | |
#3 | Materials and metallurgy | |
#4 | Chemical engineering |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Transport or storage devices | |
#3 | Cleaning | |
#4 | Treatment of glass |
# | Name | Total Patents |
---|---|---|
#1 | Niese Matthias | 13 |
#2 | Franzke Joerg | 11 |
#3 | Schweckendiek Juergen | 10 |
#4 | Osterkamp Juergen | 5 |
#5 | Joerg Franzke | 1 |
#6 | Kaltenbach Konrad | 1 |
#7 | Matthias Niese | 1 |
#8 | Schweckendiek Jurgen | 1 |
#9 | Stadler Maximilian Dr | 1 |
#10 | Juergen Schweckendiek | 1 |
Publication | Filing date | Title |
---|---|---|
DE102005015758A1 | Method and device for etching substrates received in an etching solution | |
DE10308842A1 | Device for gripping a plurality of substrates | |
DE10215284A1 | Method and apparatus for drying substrates | |
DE10215283A1 | Device for receiving substrates | |
DE10215044A1 | Process for etching and drying substrates | |
DE10127042A1 | Method for treating or handling substrates e.g. for wafers or silicon discs, involves supporting substrate in lower edge region on supporting elements | |
EP0731495A2 | Process and device for cleaning silicon wafers |