VITEX SYSTEMS INC has a total of 48 patent applications. Its first patent ever was published in 2001. It filed its patents most often in WIPO (World Intellectual Property Organization), United States and China. Its main competitors in its focus markets semiconductors, surface technology and coating and environmental technology are SAMSUNG NEC MOBILE DISPLAY CO, SUSS MICROTEC INC and CHEN MIIN-JANG.
# | Country | Total Patents | |
---|---|---|---|
#1 | WIPO (World Intellectual Property Organization) | 12 | |
#2 | United States | 10 | |
#3 | China | 8 | |
#4 | Taiwan | 6 | |
#5 | EPO (European Patent Office) | 5 | |
#6 | Republic of Korea | 4 | |
#7 | Australia | 3 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Surface technology and coating | |
#3 | Environmental technology | |
#4 | Machines | |
#5 | Electrical machinery and energy | |
#6 | Optics | |
#7 | Basic materials chemistry |
# | Name | Total Patents |
---|---|---|
#1 | Burrows Paul E | 24 |
#2 | Bonham Charles C | 23 |
#3 | Graff Gordon L | 23 |
#4 | Martin Peter M | 21 |
#5 | Gross Mark E | 21 |
#6 | Chu Xi | 20 |
#7 | Bennett Wendy D | 16 |
#8 | Moro Lorenza | 16 |
#9 | Zumhoff Mac R | 14 |
#10 | Mast Eric S | 14 |
Publication | Filing date | Title |
---|---|---|
US2010167002A1 | Method for encapsulating environmentally sensitive devices | |
US2009191342A1 | Method for edge sealing barrier films | |
US2009208754A1 | Method for edge sealing barrier films | |
WO2008094352A1 | Three dimensional multilayer barrier and method of making | |
US2007281174A1 | Multilayer barrier stacks and methods of making multilayer barrier stacks | |
US2007049155A1 | Encapsulated devices and method of making | |
US2006216951A1 | Method of making an encapsulated plasma sensitive device | |
US7198832B2 | Method for edge sealing barrier films | |
EP1497853A2 | Apparatus for depositing a multilayer coating on discrete sheets | |
US2003203210A1 | Barrier coatings and methods of making same | |
US6866901B2 | Method for edge sealing barrier films |